Combining metals. Integrating functions. Pushing boundaries.

Cooling in the boring core

Where conventional methods fail to provide cooling, MPA technology opens up new possibilities through the combination of materials. Efficient heat dissipation via copper cores boosts process stability and enhances component quality, while reducing cycle times.

Pre-chamber nozzles

Our pre-chamber nozzles for injection moulding deliver exceptional temperature control thanks to innovative MPA technology. Optionally equipped with wear protection, they offer maximum service life even when used with abrasive materials. The result: robust processes, consistently high component quality and lower maintenance costs.

Mould cores for the packaging

For mould cores in the packaging industry, we rely on highly conductive copper solutions in combination with cooling ducts. Improved heat dissipation enables shorter cycle times and greater process stability. This ensures the cost-efficient production of high-quality packaging components, even in large quantities.

Thin mould cores

For thin mould cores where it is not possible to incorporate a cooling channel, we specifically use copper solutions to improve heat dissipation. This allows heat to be dissipated more quickly and makes the process significantly more stable.

Cooling for technical components

For technical components, we specifically combine integrated cooling channels with copper to enhance heat dissipation and provide better wear protection through the use of material combinations. This reduces temperature peaks and stabilises the injection moulding process. The result is shorter cycle times, higher component quality and an extended tool life.

Multi-material printed board

Lightweight, robust and highly thermally efficient. In aerospace applications, printed boards have to cope with high thermal loads and withstand extreme mechanical stress. Conventional aluminium PCBs often reach their limits in these applications, especially when precise thermal management and reliable soldering results are essential.

MPA allows for the production of a PCB that is specifically designed to meet the thermal, mechanical and mass-critical demands of a rapidly growing aerospace infrastructure.

Our RF components set new benchmarks in space

Be it antennas, waveguides, filters or entire RF chains in a single component – we supply the world’s most precise 3D‑printed RF components.

This is enabled through our hybrid approach of combining high-precision milling and metal powder application.

The result: seamless RF structures without screws, without joints and without compromises. With surface qualities and tolerances that are unrivalled in the AM sector. Entire RF chains can be implemented in a single component – ensuring assembly is easier, cleaner, more reliable and much faster.

Cooled sputter targets

Our cooled sputter targets ensure efficient dissipation of the heat generated during sputtering and thereby stabilise the coating process.
The challenge lies in the thermal interface between the target material and the cooling structure, which we optimally resolve by applying a copper backplate directly using MPA without any soldering – even with material combinations whose melting points differ vastly, such as aluminium and titanium. Moreover, integrated cooling ducts that can be formed in the copper further improve heat dissipation.

Cooling frames with integrated heat pipes

Our cooling frames enable reliable heat dissipation in applications where conventional water cooling cannot be applied due to the risk of leaks or the presence of electrical components.
The challenge is to achieve high-performance, water-free cooling, which we address efficiently through the direct integration and optimal thermal connection of heat pipes using MPA technology. When combined with Invar, these components are ideal for high-precision, thermally stable applications in sensitive environments.

Cooling ducts in the first wall

Very high temperatures that must be controlled in the first wall through active cooling are generated in the fusion reactor. MPA technology, combined with our water-soluble filling material, enables the incorporation of cooling ducts without the need for any welding, thereby minimising distortion. Further innovative concepts, including multi-material approaches, are already in the development phase.

Internally structured heat exchanger tube

Our internally structured heat exchanger tube significantly increases the heat transfer rate of solar thermal power stations by generating a turbulent flow of the heated medium within the tube.
The challenge lies in creating complex internal geometries to enhance heat transfer, which we successfully achieve using the MPA process and hybrid manufacturing methods.

Monolithic heat exchanger plates

Our monolithic heat exchanger plates eliminate the typical risks of leakage, as they are manufactured entirely without soldered joints and, therefore, without any dissimilar material interfaces. With conventional plate heat exchangers, the challenge lies in the material inhomogeneity and the leak tightness of soldered components, which we reliably overcome through the MPA process with a fully monolithic design. The internal duct system is created using a specially developed water-soluble filling material, which enables the production of highly-precise, uniform structures that guarantee efficient cooling.
 

The internal duct system is created using a specially developed water-soluble filling material, which enables the production of highly-precise, uniform structures that guarantee efficient cooling.

Das interne Kanalsystem wird mittels eines speziell entwickelten wasserlöslichen Füllmaterials erzeugt, wodurch hochpräzise, homogene und effizient kühlende Strukturen realisiert werden können.
 

Close-to-contour cooling for press hardening

Our close-to-contour cooled press hardening dies enable highly effective and uniform quenching of heated sheet metal during the forming process.
The challenge lies in precisely guiding the cooling ducts along the die contour, which we achieve efficiently thanks to MPA technology and a specially developed water-soluble filling material. The result is high-performance tools that offer maximum cooling efficiency, shorter cycle times and consistently high component quality.
 

Component temperature control using heating wires

Our components enable precise temperature control by integrating heating wires and thermal elements directly in the material. The challenge lies in achieving reliable, uniform heat transfer, which we solve precisely by using MPA technology to create a strong, optimal thermal connection between these elements. This results in highly efficient temperature control across the entire component height – which is ideal for applications where process consistency and temperature stability are essential.

Internally cooled copper induction coils

Our internally cooled copper induction coils deliver precise geometry and high reproducibility, as they are no longer produced by manually bending copper tubes. The challenges of conventional manufacturing – geometric deviations and limited duct design – are overcome by the MPA process, which creates precise and robust internal cooling ducts using a water-soluble filling material. The result is compact, high-performance coils that guarantee optimal cooling, even with very small duct diameters and complex demands.

Sealing bars for producing spout pouches

Our sealing bars ensure precise and consistent temperature control when sealing spouts in plastic pouches. The challenge lies in reliably controlling the temperature of complex sealing contours, which we solve optimally by selectively integrating copper in stainless steel using MPA technology. This allows us to achieve the highest temperature accuracy at the sealing edge, thereby significantly improving process stability, component quality and repeatability.

Welding bars for the packaging

Our welding bars ensure efficient and precise heat transfer to the welding edge when cutting and sealing plastic pouches. The challenge lies in the precise temperature control of complex geometries, which we master through a carefully engineered combination of materials: high thermal conductivity copper and robust, chemically resistant stainless steel. This way, we achieve a rapid temperature response, high process reliability and consistently clean weld seams.

Temperature-controlled glue nozzle

Our temperature-controlled glue nozzles ensure that glue is consistently applied within a precisely defined temperature range. The challenge lies in achieving precise and stable temperature control, which we reliably ensure by integrating heating elements and using copper-based MPA technology to provide an optimised thermal connection. This results in compact tools with rapid heat transfer, high process consistency and reproducible product quality.