Aluminium board with Cu inlays: Solder quality and passive heat dissipation
Using the MPA process, copper segments were applied to an aluminium board to serve as solderable pads and local heat spreaders. The aim is to improve soldering results and enhance heat dissipation directly beneath power or temperature-critical electronic components – without additional interlayers or separate carrier parts.
Solution and functional principle
Copper segments on aluminium base body: The copper surfaces improve wetting during soldering and reduce thermal resistance at the component hot spot.
Solid-state application (independent of the melting point): The copper ↔ aluminium combination is created without melting the base materials, thereby enabling a reliable bond between copper and aluminium.
Geometry as required: The size, thickness and arrangement of the copper pads are tailored to their specific function – ranging from individual solder pads to continuous heat spreader zones.
Benefits for injection moulding
Improved solderability on copper: Consistent solder joint quality compared to direct soldering on aluminium.
Effective heat dissipation (passive): Copper heat spreaders beneath the component shorten the heat path and help maintain lower operating temperatures.
Applications without active cooling: Particularly suited where liquid cooling or direct medium contact is not permitted (e.g. space/vacuum, confined installation spaces, media-free systems).
Design freedom: Properties are applied where needed; thermal and soldering functions are integrated into the actual carrier, which can simplify assembly.
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